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High Temperature HP-HZ Ceramic Fiber Board For Back Up Lining

high temperature HP-HZ ceramic fiber board for
high temperature HP-HZ ceramic fiber board for

Ceramic fiber board is manufactured in a wet forming process using ceramic fiber bulk and binders. Ceramic fiber board is designed for insulation applications experiencing vibration, mechanical stress and erosive forces.

Parameter

CERAMIC FIBER BOARD / RCF Board

Ceramic fiber board is manufactured in a wet forming process using ceramic fiber bulk and binders. Ceramic fiber board is designed for insulation applications experiencing vibration, mechanical stress and erosive forces. Ceramic fiber board can reduce energy costs and cycling times due to high insulating capability, as well as serving to protect refractory surfaces from thermal shock and chemical attack.


Features

Excellent thermal shock resistance

Can be machined, cut and shaped easily

High rigidity and light weight

Low thermal conductivity

Low heat storage


Typical Applications

Furnace hot face lining in petrochemical furnace

Furnace hot face lining in ceramic kiln

Board over blanket hot face lining

Back-up insulation to brick & castable

Expansion joints




Parameter2

EscriptionSTD BOARDHP BOARDHA BOARDHZ BOARD
Classification Temperature (℃)1260126013501430
ColorWhiteWhiteWhiteWhite
Density (kg/m³)250/300/360250/300/360300/360300/360
Modules of Rupture (MPa)≥0.3≥0.3≥0.3≥0.3
Compressive Strength (MPa, 10% relative deformation)0.15/0.25/0.30.25/0.30.25/0.30.25/0.3
Loss of Ignition (%)≤6≤6≤6≤6
Permanent Linear Shrinkage (%)1000℃ x 24h ≤3.01000℃ x 24h ≤3.01100℃ x 24h ≤3.01350℃ x 24h ≤3.5
Thermal Conductivity (W/m·K)
400℃0.080.070.070.07
600℃0.110.100.100.09
800℃0.140.140.130.13
1000℃0.190.190.190.18

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